Black Condutive PS/ABS/PS Raw Material Sheet

💎 Core Selling Points
It is this "hard and soft" structure that gives it comprehensive advantages that a single material cannot match:

✔Balanced rigidity and toughness, strong and durable: It solves the pain points of pure PS sheets that are "brittle and easy to crack". The ABS core layer greatly improves the material's impact strength, making it less likely to break when under pressure or dropped. Production data shows that compared with traditional processes, the tensile strength of carrier tapes using a three-layer structure can be increased by 50%, making them stronger and more durable.

✔Dimensional stability and extremely high precision: The PS surface layer gives the sheet excellent surface flatness and rigidity, combined with the low shrinkage characteristics of ABS, making the product dimensionally very stable. It can therefore achieve extremely high-precision processing. For example, it can produce ultra-precision carrier tapes with a minimum pocket hole diameter of 0.2mm and an opening R angle of ≤0.1mm.

✔Improved heat resistance and support for high-speed processing: The addition of ABS improves the heat resistance of the overall material, improves its heat deformation temperature, and enables stable molding on high-speed roller machines, greatly improving production efficiency.

✔Flexible design allows for functionalization: This multi-layer co-extruded structure facilitates functional design. Conductive or antistatic coatings can be easily applied to the outermost layer, making it an ideal packaging material for protecting precision electronic components (such as IC chips, semiconductors) from electrostatic breakdown.

🎯 Main application areas
With the above advantages, it mainly serves areas that require extremely high protection and precision:

✔Electronic component carrier tape: used to carry and transport tiny electronic components such as ICs, connectors, resistors, and capacitors.

✔Semiconductor packaging: used as carrier or protective material in the chip packaging process.

✔Precision instrument tray: used as a high-cleanliness, high-precision blister tray or liner.

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