PS Black Conductive Carrier Tape Material

PS Black Conductive Carrier Tape Material

PS black conductive carrier tape material is a specialized sheet material used for manufacturing electronic packaging "carrier tapes." Through a vacuum thermoforming process, it is fabricated into carrier tapes featuring pockets designed to hold surface-mount components—such as resistors, capacitors, ICs, connectors, and LEDs. When used in conjunction with a cover tape, these carrier tapes are suitable for use on automated assembly lines.
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Product Introduction

✔Standard Thickness: 0.20 mm to 1.0 mm (commonly 0.30, 0.35, 0.40, and 0.50 mm).

 

✔Width Range: Slit according to customer requirements; common widths range from 8 mm to 120 mm, while the standard master roll width is approximately 640 mm to 660 mm.

 

✔Structure: Typically utilizes three-layer co-extrusion technology, featuring a conductive outer layer and a mechanical reinforcement layer in the middle.

 

✔Excellent Conductivity: Surface resistivity is typically controllable within the range of 10⁴ – 10⁶ Ω/sq (or Ω/cm²), effectively dissipating static electricity and preventing electrostatic discharge (ESD) damage to precision electronic components.

 

✔High Physical Strength: Exhibits excellent rigidity, toughness, and impact resistance, along with superior dimensional stability; it resists deformation during high-speed forming and component placement processes.

 

✔Strong Processing Adaptability:Features excellent material flow properties, facilitating easy thermal processing and vacuum forming. It is well-suited for deep-draw forming applications, yielding uniform thickness after molding in full compliance with the EIA-481 international standard (the carrier tape standard established by the Electronic Industries Alliance).

 

✔Clean and Eco-friendly: Complies with RoHS (Restriction of Hazardous Substances) standards and is free from heavy metals and halogens. However, please note that black conductive products-due to the inclusion of carbon black additives-may present a slight risk of surface contamination caused by material migration.

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